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Technical Specification ofgreen laster pointer

November 17th, 2011 at 05:26 am

Access to imaging technology in the industrial production of the PCB has many years of history, contact the original photo imaging technology needs, and the bottom plate with PCB exposure, the production must be fully exposed. In the imaging process, the production of direct exposure to ultraviolet bottom plate, the light through the bottom plate formed on the transparent part of the PCB shaded, the exposure time according to the requirements of photoresist may be, usually 10-30 seconds. The solder resist exposure requires greater exposure intensity, usually require 200-500mJ/cm2 range. The detector ofBlue Laser Pointerintelligent system has group management mode.
However, the development of PCB technology makes contact with the limitations of imaging more and more obvious. First, with the large wire or printed circuit board space continues to become thin (about 0.003 inches) and the positioning accuracy, resolution increases resulting from a series of problems, and are difficult to solve. The previous process requirements rarely open and short circuit caused by the PCB situation, and now this directly to PCB scrap. Secondly, the larger the contact area prone to uneven line width and edge sharpness of the change, which is not allowed in production. And fine positioning of the strict requirements of graphical PCB can not be completed with simple access to imaging technology. green laster pointer intelligent management system product manufactured by the company will definitely be your best choice.
The use of PCB exposure and production of imaging only in full contact between the bottom plate can be done well, but the actual production is not very accurate due to location and can not meet both have full contact, so often can not achieve the desired requirements. Finally, repeated exposure of the production process is the production of negatives and printed duplicate contacts. This is the introduction of a number of other problems: such as impurity contamination, bottom plate and to shorten the life of liquid photoresist dip in the end version of the upper. LPI is a transfer of the advantages of various types of images as a whole, the use of ultraviolet laser energy for the high output optical projection imaging technology with high resolution and yield, Figure 1.1 is the LPI system, structure, floor and printing board placed on both sides of the same platform, so you can scan in both directions simultaneously. Overview of 100mW laser pointer intelligent system will be introduced in details.
Laser refraction from the platform by a hexagon of area under the irradiation floor, so a total refraction through the projection lens, the image can be formed on the printed circuit board. PCB backplane with each other to maintain a fixed platform to spiral movement, ensure that the entire image can be projected on the floor of the PCB, the PCB on which a good pre-coated with photoresist. Laser to compensate for the continuous scan mode, and eventually form a complete coincidence PCB exposure, and even graphics. Such a small area of the expected resolution projection lens, you can move freely only need the right platform and operating software, the cost will be completed under the conditions of a perfect pattern transfer, and high yield. Final inspection of200mW Laser Pointer is very important.
LPI system is to use a larger area of the laser beam, so the exposure time produces tens of thousands of pixels in parallel. As the laser is provided by the high power output of pure UV, during the scanning process platform to high-speed scanning motion. With the high-energy laser source, high transmittance and high-speed laser scanning platform, set the three points as a whole, not only for the transfer of conventional printed circuit board images, and graphics for the solder can also be done through this system. It is not just a painting, but also 5mW laser pointerat the same time.